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Solder Paste in Electronics Packaging:  Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

de Hwang, Jennie S

  • Usado
  • Aceptable
  • Tapa dura
  • Firmado
  • First
Estado
Fine/Fine
ISBN 10
0442207549
ISBN 13
9780442207540
Librería
Puntuación del vendedor:
Este vendedor ha conseguido 5 de las cinco estrellas otorgadas por los compradores de Biblio.
Minneapolis, Minnesota, United States
Precio
EUR 133.56
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Sobre este artículo

New York: Van Nostrand Reinhold, 1989 WYSIWYG pricing--no added shipping charge for standard shipping within USA. Inscribed by author. Black paper-covered boards textured to resemble cloth, foil titles on spine, xxiii, 456 pp, references, index, numerous photos, drawings, charts, and tables. Inscribed on recto of ffep, dated Feb 1991. DJ in Brodart archival cover. Contents: chemical and physical characteristics; metallurgical aspects, rheology of solder pastes; application techniques; soldering methodologies; cleaning; solder joint reliability and inspection; special topics in surface mount soldering problems and other soldering-related problems; quality assurance and tests; future developments. Appendices: federal specification QQ-S-571E and amendment 4; ternary phase diagram: Pb-Ag-Sn, Sn-Pb-Bi; military specification MIL-P-28809A: printed wiring assemblies; quantitative determination of rosin residues on cleaned electronics assemblies. Shipping weight 3 lbs. (International 2 lbs., 4 oz.). First Edition. . Fine/Fine. 23½ X 15½ cm.

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Detalles

Librería
Twin City Antiquarian Books US (US)
Inventario del vendedor #
TEEC00011
Título
Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
Autor
Hwang, Jennie S
Formato/Encuadernación
Tapa dura
Estado del libro
Usado - Fine
Estado de la sobrecubierta
Fine
Edición
First Edition
ISBN 10
0442207549
ISBN 13
9780442207540
Editorial
Van Nostrand Reinhold
Lugar de publicación
New York
Fecha de publicación
1989
Palabras clave
Technical Electronics
X weight
48 oz
Size
23½ X 15½ cm

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Twin City Antiquarian Books

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Sobre el vendedor

Twin City Antiquarian Books

Puntuación del vendedor:
Este vendedor ha conseguido 5 de las cinco estrellas otorgadas por los compradores de Biblio.
Miembro de Biblio desde 2005
Minneapolis, Minnesota

Sobre Twin City Antiquarian Books

We are mail-order sellers of used and out-of-print books, selling on the Web since 2000.

Glosario

Algunos términos que podrían usarse en esta descripción incluyen:

Brodart
Generally used to refer to a clear plastic cover that is sometimes added to the dustjacket or outside covering of a book. The...
Recto
The page on the right side of a book, with the term Verso used to describe the page on the left side.
Spine
The outer portion of a book which covers the actual binding. The spine usually faces outward when a book is placed on a shelf....
First Edition
In book collecting, the first edition is the earliest published form of a book. A book may have more than one first edition in...
FFEP
A common abbreviation for Front Free End Paper. Generally, it is the first page of a book and is part of a single sheet that...
Cloth
"Cloth-bound" generally refers to a hardcover book with cloth covering the outside of the book covers. The cloth is stretched...
Inscribed
When a book is described as being inscribed, it indicates that a short note written by the author or a previous owner has been...

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