Package Electrical Modeling, Thermal Modeling, and Processing for GAAS Wireless Applications Tapa dura - 1998

Boston: Kluwer Academic Publishers, 1999. Name from previous owner on FEP. No dust jacket. Binding is very well preserved, pages are clean and crisp, and printing is tight, clean and bright throughout. MB. hardcover. Good/No Dust Jacket. Used.

New. Never used book

Kap, 1998. 1st. Hardcover. New/New.

Secaucus, New Jersey, U.S.A.: Kluwer Academic Pub, 1998 hardback book in near fine condition. Hardcover. Near Fine.

Boston: Kluwer Academic Publishers. Very Good with no dust jacket. 1999. Hardcover. 0792383648 . Library stamps/marks/labels/pocket, otherwise light wear. Solid hardcover.; "Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications reviews the practical aspects of electrical and thermal modeling of packages and has no equivalent on the market, since it discusses analog (microwave) packaging as opposed to digital packaging. This book emphasizes low-cost industry-standard packages; however, the principles translate well to other categories of packages. The need for this book arises from the fact that low-cost packages have not been optimized for high-frequency use. With high-volume commercial wireless markets now expanding and cost reduction a primary concern, the interest in modeling as a significant cost-cutting tool is high. Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications addresses this interest and… Leer más

Hard Cover. New. New Book; Fast Shipping from UK; Not signed; Not First Edition; The Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications.

Springer. Hardcover. New. 9x6x0.