Three-Dimensional Integrated Circuit Design: Eda, Design and Microarchitectures Tapa dura - 2009 - 1st Edición
de Yuan Xie (Editor); Jingsheng Jason Cong (Editor); Sachin Sapatnekar (Editor)
Descripción de contraportada
This book presents an overview of the field of 3D IC design, with an
emphasis on electronic design automation (EDA) tools and algorithms
that can enable the adoption of 3D ICs, and the architectural
implementation and potential for future 3D system design. The aim of
this book is to provide the reader with a complete understanding of:
- the promise of 3D ICs in building novel systems that enable the chip
industry to continue along the path of performance scaling,
- the state of the art in fabrication technologies for 3D integration,
- the most prominent 3D-specific EDA challenges, along with solutions
and best practices,
- the architectural benefits of using 3D technology,
- architectural-and system-level design issues, and
- the cost implications of 3D IC design.
Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures is intended for practitioners in the field, researchers and graduate students seeking to know more about 3D IC design.
Detalles
- Título Three-Dimensional Integrated Circuit Design: Eda, Design and Microarchitectures
- Autor Yuan Xie (Editor); Jingsheng Jason Cong (Editor); Sachin Sapatnekar (Editor)
- Encuadernación Tapa dura
- Número de edición 1st
- Edición 1
- Páginas 284
- Volúmenes 1
- Idioma ENG
- Editorial Springer
- Fecha de publicación 2009-12-10
- Ilustrado Sí
- Features Bibliography, Illustrated, Index
- ISBN 9781441907837 / 1441907831
- Peso 1.31 libras (0.59 kg)
- Dimensiones 9.21 x 6.14 x 0.69 pulgadas (23.39 x 15.60 x 1.75 cm)
-
Temas
- Aspects (Academic): Science/Technology Aspects
- Library of Congress subjects Integrated circuits - Design and construction
- Número de catálogo de la Librería del Congreso de EEUU 2009939282
- Dewey Decimal Code 620
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